Description
Hempaprime CUI 275 is a phenolic epoxy improvement based on fast drying, alkylamine cured epoxy. It provides long lasting barrier protection in coating systems for severe corrosive environments, including high temperature and wet conditions found beneath thermal insulation.
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Features
Fast overcoating. Wide temperature resistance from cryogenic up to 275°C (527°F). Can be applied at temperatures down to -10°C (14°F). Can be spray applied on hot surfaces up to 204°C (400°F). Excellent crack resistance compared to traditional epoxy phenolic coatings. -
Recommended use
Hempaprime CUI 275 can be used across a wide temperature range where corrosion under insulation (CUI) typically occurs and where thermal cycling is present. It can be specified for operating temperatures from -196°C (-321°F) to 204°C (400°F), with sporadic allowance up to 275°C (527°F). The product significantly reduces the risk of cracking when applied at high DFTs compared to traditional epoxy phenolic coatings. It can be used in new construction and maintenance and repair, on carbon and stainless steels, and for both insulated and uninsulated service. -
Markets and application
Oil and Gas/DownstreamOil and Gas/UpstreamThermal Power/Thermal powerMarine/Marine dry dockMarine/Marine seastockMarine/Marine new buildInfrastructure/Civil structures
