Description
Hempaprime CUI 275 is a phenolic epoxy improvement based on fast drying, alkylamine cured epoxy. It provides long lasting barrier protection in coating systems for severe corrosive environments, including high temperature and wet conditions found beneath thermal insulation.
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Features
Fast overcoating. Wide temperature resistance from cryogenic up to 275°C (527°F). Can be applied at temperatures down to -10°C (14°F). Excellent crack resistance over traditional epoxy phenolic coatings. Aluminium pigmented. -
Recommended use
Hempaprime CUI 275 can be used across a wide temperature range where corrosion under insulation (CUI) typically occurs and also where thermal cycling is present. The product significantly reduces the risk of cracking when applied at high DFTs compared to traditional epoxy phenolic coatings. It can be used in new construction and maintenance and repair, on carbon and stainless steels, and for both insulated and uninsulated service. Hempaprime CUI 275 can be applied at temperatures down to -10°C (14°F) and is suitable for application onto hot surfaces up to 204°C (400°F). -
Markets and application
Oil and Gas/DownstreamOil and Gas/UpstreamThermal Power/Thermal power
